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Applications:
- Bakelite collets are mainly used for LED/LD/PD/PTR chips in semiconductor IC die bonding assembly processes.
- G.C Micro has stable process capability and can provide various types based on the required specifications, including die dimensions, top-surface structure design and process temperature requirements (25–480 °C).
Applications:
- Bakelite collets are mainly used for LED/LD/PD/PTR chips in semiconductor IC die bonding assembly processes.
- G.C Micro has stable process capability and can provide various types based on the required specifications, including die dimensions, top-surface structure design and process temperature requirements (25–480 °C).
Applications:
- Bakelite collets are mainly used for LED/LD/PD/PTR chips in semiconductor IC die bonding assembly processes.
- G.C Micro has stable process capability and is able to provide various types based on the required specifications, including die dimensions, top surface structure design and process temperature requirements (25–480 °C).
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