Assembly Processes

• Bakelite collets are mainly used for LED/LD/PD/PTR chips in semiconductor IC die bonding assembly processes.
• G.C Micro has stable process capability and can provide various types based on the required specifications, including die dimensions, top-surface structure design and process temperature requirements (25–480 °C).

• Bakelite collets are mainly used for LED/LD/PD/PTR chips in semiconductor IC die bonding assembly processes.
• G.C Micro has stable process capability and can provide various types based on the required specifications, including die dimensions, top-surface structure design and process temperature requirements (25–480 °C).

Applications:

• Bakelite collets are mainly used for LED/LD/PD/PTR chips in semiconductor IC die bonding assembly processes.
• G.C Micro has stable process capability and is able to provide various types based on the required specifications, including die dimensions, top surface structure design and process temperature requirements (25–480 °C).

Applications:

• BAS and BAR series rubber tips are mainly used for chip sorting and semiconductor IC die bonding during assembly processes.
• G.C Micro has stable process capability and is able to provide various types based on the required specifications, including die dimensions, top surface structure design and process temperature considerations.

Applications:

• Cylinder (BB and BJ series) rubber tips are mainly used for semiconductor IC die bonding, final testing and tape-and-reel packing assembly processes.
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Applications:

• BAC series rubber tips are mainly used for chip sorting and semiconductor IC die bonding during assembly processes.
• They are available in various ID/OD designs to accommodate different die dimensions and appearance requirements.